Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
電子デバイス製造装置
Document Type and Number:
Japanese Patent JP6666779
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic device manufacturing apparatus capable of easily performing alignment every time and manufacturing an electronic device with a small number of manufacturing steps and high precision in each step required when TFT or the like is manufactured by printing.SOLUTION: An electronic device manufacturing apparatus includes an impression cylinder 110 rotating while holding a sheet, a plate cylinder 130 for transferring functional ink to the sheet held on a holding surface of the impression cylinder 110, sheet position detecting means 301, 302 for detecting the position in a circumferential direction and an axial direction of a pattern of the sheet held by the impression cylinder 110, right and left position adjusting means 171 to 183 and 219 for adjusting the position in the axial position of the plate cylinder 130, top and bottom position adjusting means 188, 189 and 203 for adjusting the rotational phase of the impression cylinder 110 and the plate cylinder 130, and a control device 200 for controlling the right and left position adjusting means and the top and bottom position adjusting means based on the positions in the circumferential direction and the axial direction of the sheet which are obtained by the sheet position detecting means when the functional ink is transferred to the sheet.SELECTED DRAWING: Figure 1

Inventors:
Ikuo Sugimoto
Application Number:
JP2016078610A
Publication Date:
March 18, 2020
Filing Date:
April 11, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Komori Corporation
International Classes:
H01L21/336; B41F17/14; B41F33/08; B41J2/01; H01L29/786
Domestic Patent References:
JP2015150711A
JP2015153796A
JP2014196175A
JP2008173805A
Foreign References:
WO2005098927A1
WO2013176222A1
Attorney, Agent or Firm:
Shigeki Yamakawa
Masaki Yamakawa



 
Previous Patent: 吸着仮固定材

Next Patent: 電子デバイス製造装置