Title:
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2006216587
Kind Code:
A
Abstract:
To provide a manufacturing method capable of forming resin layers to be thick, without causing deformations, cracks or separations of the resin layers in the manufacturing of electronic devices provided with a plurality of resin layers, and to provide the electronic device.
This for manufacturing the electronic device that is provided with a first insulating resin layer 11 provided on a substrate 1, a wiring layer 12 provided on the first insulating resin layer 11, and a second insulating resin layer provided on the first insulating resin layer 11 and the wiring layer 12. Prior to forming the second insulating resin layer, plasma treatment is applied to the surface of the first insulating resin layer 11.
Inventors:
ABE HIROSHI
ITO TATSUYA
ITO TATSUYA
Application Number:
JP2005024887A
Publication Date:
August 17, 2006
Filing Date:
February 01, 2005
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
H01L21/56; H01L23/12
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama