Title:
電子デバイス用部材および電子デバイスの製造方法、ならびに電子デバイス用部材
Document Type and Number:
Japanese Patent JP5408374
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To manufacture an electronic device member which suppresses detachment of a seal material and damage of a substrate.SOLUTION: A manufacturing method of an electronic device member includes a lamination step, a curing step, and a detachment step. In the lamination step, a pair of laminates are laminated with a first seal material and a second seal material interposed therebetween under reduced pressure. The pair of laminates comprise: a substrate having one or more element formation regions on which an electronic device is formed; and a reinforcement plate detachably bonded to the substrate. The first seal material is arranged in a periphery of the element formation region. The second seal material is arranged outside an aggregation region of the first seal material and has a frame-like shape. The curing step causes the first seal material and the second seal material to cure. The detachment step detaches the reinforcement plate from the substrate.
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Inventors:
Hiroshi Utsugi
Yasunori Ito
Manabu Nito
Mitani Majo
Yasunori Ito
Manabu Nito
Mitani Majo
Application Number:
JP2013060431A
Publication Date:
February 05, 2014
Filing Date:
March 22, 2013
Export Citation:
Assignee:
Asahi Glass Co., Ltd.
International Classes:
G09F9/00; G02F1/1333; G02F1/1339; G09F9/30; H01L27/32
Domestic Patent References:
| JP2012063761A | ||||
| JP9311340A | ||||
| JP2008309818A | ||||
| JP2010113377A |
Foreign References:
| WO2012090943A1 | ||||
| WO2008139736A1 |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office