To provide an electronic device and a method for forming the electronic device.

The method for forming the electronic device is disclosed. In the method, (a) a base body and a part connected to the base body are provided, and the part is selected from an electronic part, an optical part, a device lid and these combination in this case; (b) the base body and/or the part is coated with solder paste, and the solder paste contains a carrier vehicle and a metallic part with metallic particles in this case; and (c) the base body and the part are brought into contact mutually. Solder paste has a solidus-line temperature lower than that, which may be obtained after the melting of solder paste and the re-solidification of a melted article. The electronic device formed by the method is provided. A specific applicability is discovered in electronics in the formation of a sealed electronic device package such as one formed from a semiconductor wafer.