To provide an electronic device with high connection reliability, and a method of manufacturing the electronic device.
The electronic device 10 includes an electronic component 11, a substrate 12, solder 13, a first polymer layer 14, and a second polymer layer 15, wherein the electronic component 11 and substrate 12 are electrically connected to each other with the solder 13, the first polymer layer 14 is formed between the electronic component 11 and substrate 12 where the solder 13 is not present, and the second polymer layer 15 is formed in contact with a circumference of the electronic component 11 and the substrate 12 to surround at least part of a side face of the first polymer layer 14, the first polymer layer 14 having a lower elastic modulus than the second polymer layer 15.
Yumi Nakayama
Reiko Yoshida
Isaji So