ELECTRONIC DEVICE RESIN SEALING METHOD AND LEAD FRAME PROVIDED THEREFOR

Japanese Patent JPH07135230

A

PURPOSE: To lessen resin wasted in a throwaway part such as a cull or a runner in quantity so as to reduce the amount of resin used to an irreducible minimum and to enhance resin material in use yield in a resin sealed-type semiconductor package of an electronic device.

CONSTITUTION: A lead frame 1 is equipped with a resin tablet hole 5 at its center where a resin tablet of molding material is located, the resin tablet hole 5 is regarded as a cull (pot), and four gates 12 are provided around the resin tablet hole 5 in a radial manner, and also the lead frame 1 is provided with semiconductor device forming region ICs where semiconductor devices are mounted and which are provided corresponding to the gates 12. Resin is directly poured into a cavity from a pot through the gates 12 connected to the cavity without using a runner. By this setup, a pot is disposed at the center of a lead frame, so that a distance between the pot and a cavity is short, and resin wasted in a throwaway part such as a cull or a runner used in a conventional molding structure can be lessened in amount.

JPS586575	[Title of the Invention] Metallic mold detaching device
WO/1999/030883	CONTAINER WITH MULTIPLE INTEGRAL CONNECTION HANDLE, PREFORM AND METHOD OF MANUFACTURE

HIGUCHI AKIRA
HIRASHIMA TOSHINORI
MURAKAMI HAJIME
SHIMIZU KAZUO
ARAI KATSUO
SOBA TAKUMI
KOYAMA YASUHIRO
TOGAWA MITSUO

JP27926493A

May 23, 1995

November 09, 1993

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HITACHI LTD

B29C45/26; B29C45/02; B29C45/14; H01L21/56; H01L23/50; B29L31/34; (IPC1-7): H01L21/56; B29C45/02; B29C45/14; B29C45/26; H01L23/50

Ogawa Katsuo

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