Title:
ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2002076684
Kind Code:
A
Abstract:
To provide an electronic device to surely fusion-bond a shield case to a specified position.
An electronic component 2 where an electronic components element 22 is housed in a vessel comprising a housing body 21 and a metal lid 23 is mounted on a substrate 1 while coated with a metal shield case 4 fusion-bonded to the metal lid 23. An alignment recessed part 44 is so formed on the metal shield case 4 as to enclose the metal lid 23.
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Inventors:
ISHIMOTO MICHIHIRO
Application Number:
JP2000261748A
Publication Date:
March 15, 2002
Filing Date:
August 30, 2000
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H05K9/00; H03B5/32; (IPC1-7): H05K9/00; H03B5/32
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