Title:
ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2017208273
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic device which can inhibit reduction of a mounting area of a substrate while securing connection reliability between a terminal and a substrate.SOLUTION: An electronic device includes a substrate 10, an electronic component, a connector, and a solder 50. A bottomed hole 12 recessed on one surface 10a is formed on the substrate 10. The electronic component is disposed on the one surface 10a of the one surface 10a and a rear surface 10b. The connector has a housing and a peg 36. The housing is disposed on the one surface 10a side. The peg 36 is fixed to the housing, extends from a portion fixed to the housing to the bottomed hole 12, and is inserted into the bottomed hole 12. The solder 50 is disposed in the bottomed hole 12, contacts with an inner wall surface of the bottomed hole 12 and the peg 36, and mechanically connects the substrate 10 with the peg 36.SELECTED DRAWING: Figure 5
Inventors:
HAMATSU YOICHI
Application Number:
JP2016100780A
Publication Date:
November 24, 2017
Filing Date:
May 19, 2016
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01R12/51; H01R12/71; H05K1/02; H05K1/18; H05K3/34
Attorney, Agent or Firm:
Kazuyuki Yahagi
Taihei Nonobe
Takanori Kubo
Taihei Nonobe
Takanori Kubo
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