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Patent Searching and Data


Title:
電子デバイス
Document Type and Number:
Japanese Patent JP6727937
Kind Code:
B2
Abstract:
An electronic device includes a first board, a second board, and support pillars. The support pillars hold the first board and the second board mutually separated. The first board has a first surface on which an electronic component is mounted. The first board has a second surface that includes depressed portions into which the support pillars extending from the second board are inserted.

Inventors:
Tomoyuki Hosoda
Junichi Arai
Application Number:
JP2016115841A
Publication Date:
July 22, 2020
Filing Date:
June 10, 2016
Export Citation:
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Assignee:
Nippon Denpa Industry Co., Ltd.
International Classes:
H03B5/32; H01L25/00; H05K1/14
Domestic Patent References:
JP2008085744A
JP3825475B2
JP2009164672A
JP4117806A
JP2004200916A
JP2015177245A
Foreign References:
US20050230825
US20060284309
Attorney, Agent or Firm:
Tomihiko Isono
Kazuya Nishi