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Title:
ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JPH01152747
Kind Code:
A
Abstract:

PURPOSE: To obtain a superconducting wiring having high mechanical strength and displaying excellent superconductive characteristics by interposing a metallic nitride film or a carbide film as the foundation of an oxide superconducting thin film.

CONSTITUTION: An impurity diffusion layer 13 is formed into an opening section in an insulating film 12, and thin-film wirings having a titanium nitride film 14 as a foundation and having a YBa2Cu3O7-δ film 15 on the film 14 are shaped as wiring layers being in contact with the impurity diffusion layer 13. In the forming process of the thin-film wirings, the titanium nitride film 14 is formed onto the whole surface through a sputtering method first, the YBa2Cu3O7-δ film 15 is shaped onto the whole surface of the film 14 through the sputtering method, and machined and a desired wiring pattern is formed, and heat treatment is executed. Accordingly, superconductive characteristics having sufficient mechanical strength, even excellent crystallizability and high reliability on a large number of substrates can be acquired.


Inventors:
SHIMA SHOHEI
Application Number:
JP31266087A
Publication Date:
June 15, 1989
Filing Date:
December 10, 1987
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H01L21/3205; H01L21/31; H01L23/52; H01L39/06; (IPC1-7): H01L21/88; H01L21/95; H01L39/06
Attorney, Agent or Firm:
Takehiko Suzue (2 outside)



 
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