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Title:
有機半導体材料を含む電子デバイス
Document Type and Number:
Japanese Patent JP2005516421
Kind Code:
A
Abstract:
An electronic device includes first and second electrical contacts electrically coupled to a semiconductor polymer film, which includes mono-substituted diphenylhydrazone.

Inventors:
Stashk, james
Application Number:
JP2003564953A
Publication Date:
June 02, 2005
Filing Date:
January 28, 2003
Export Citation:
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Assignee:
Hewlett-Packard Development Company
International Classes:
H01L27/10; H01L21/4763; H01L27/28; H01L29/76; H01L29/786; H01L35/24; H01L51/00; H01L51/05; H01L51/30; H01L51/40; H01L23/48; H01L27/30; (IPC1-7): H01L51/00; H01L27/10; H01L29/786
Domestic Patent References:
JPH08143550A1996-06-04
JPH06204221A1994-07-22
Attorney, Agent or Firm:
Shoichi Okuyama
Arihara Koichi
Matsushima Tetsuo



 
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