Title:
ELECTRONIC DIE PACKAGE ASSEMBLY HAVING SUPPORTING PART AND ITS METHOD
Document Type and Number:
Japanese Patent JP3725607
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a package assembly for rigidly supporting an electronic die on a fitting substrate, and to provide a forming method.
SOLUTION: A method for forming a package assembly contains a package 12 into which the electronic die is filled. A lead frame has an edge rail and the die is arranged on the lead frame. The package is formed around the flame so that the die is filled and the lead frame is trimmed. Plural leads 14 protruding from the first side of the package are provided. A supporting part 16 connected to the second side of the package is formed by trimming. The supporting part is bent in such a way that it is almost orthogonal to the common plane containing the leads. A fitting tip 26 of the supporting part is arranged on the outer side of the common plane. The supporting part improves the rigidity and the natural bending frequency of the package assembly.
Inventors:
Victor Jay Adams
David Jay Duarty
David Jay Duarty
Application Number:
JP8892496A
Publication Date:
December 14, 2005
Filing Date:
March 19, 1996
Export Citation:
Assignee:
Freescale Semiconductor, Inc.
International Classes:
H01L23/50; G01P1/02; H05K3/30; (IPC1-7): H01L23/50
Domestic Patent References:
| JP6334092A | ||||
| JP63169055A | ||||
| JP5315523A | ||||
| JP8191127A | ||||
| JP2072556U |
Foreign References:
| US5659950 |
Attorney, Agent or Firm:
Mamoru Kuwagaki