ELECTRONIC ELEMENT SEALING CASE AND ELECTRONIC PART PROVIDED THEREWITH

Title:

ELECTRONIC ELEMENT SEALING CASE AND ELECTRONIC PART PROVIDED THEREWITH

Document Type and Number:

Japanese Patent JP3868127

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide an electronic element sealing case that can be lessened in height adopting a press-fit sealing type which is high in sealing reliability and an electronic part provided therewith.
SOLUTION: An electronic element sealing case 10 is composed of a cap 12 and a base 11, where the cap 12 is fitted into the base 11 to hermetically seal up an electronic element 14 arranged on the base 11. The opening 15 of the cap 12 is nearly elliptical in cut surface, and the base 11 spreads out in the direction of press-fitting.

Inventors:

Akira Okuno
Shuichi Matsui

Application Number:

JP26327598A

Publication Date:

January 17, 2007

Filing Date:

September 17, 1998

Export Citation:

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Assignee:

NEC Shot Components Co., Ltd.

International Classes:

H01L23/02; H03H9/02; H03H9/10; (IPC1-7): H01L23/02; H03H9/02; H03H9/10

Domestic Patent References:

JP53061294A
JP52045372U
JP63048910A
JP8316772A

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