Title:
ELECTRONIC ENDOSCOPE DEVICE
Document Type and Number:
Japanese Patent JP2013013494
Kind Code:
A
Abstract:
To provide an electronic endoscope device capable of achieving excellent EMC(electro-magnetic compatibility) without forming a core in the inside of a processor.
A processor 20 to which a video scope 10 is connected includes buffer circuits 22, 24 on the side of a connector 20C serving as a scope connecting portion. In a state where the video scope 10 is connected to the processor, a maximum power supply voltage Vm is supplied to the buffer circuits 22, 24 via a DC/DC converter 36. When the video scope 10 is disconnected, a minimum power supply voltage Vz is supplied to the buffer circuits 22, 24.
More Like This:
Inventors:
OTAKI TAKUMA
Application Number:
JP2011147360A
Publication Date:
January 24, 2013
Filing Date:
July 01, 2011
Export Citation:
Assignee:
HOYA CORP
International Classes:
A61B1/04; G02B23/24
Attorney, Agent or Firm:
Takashi Matsuura
Hiroki Ogura
Shigeru Torayama
Takuya Fuji
Hiroki Ogura
Shigeru Torayama
Takuya Fuji
Previous Patent: ULTRASONIC DIAGNOSTIC APPARATUS AND MEDICAL IMAGE DIAGNOSTIC APPARATUS
Next Patent: GAME MACHINE
Next Patent: GAME MACHINE