PURPOSE: To obtain the electronic endoscope image pickup device which is excellent in its optical characteristic, and also, is thinned by facing down a solid-state image pickup element against a ceramic substrate, and connecting electrically each pad thereof by mutual press-contacting fixation.

CONSTITUTION: A ceramic substrate 1 consists of a recessed external structure which can contain a CCD 2, a window 4 opposed to the image pickup face 3 of the CCD 2 is formed, and from this window 4, light from an objective optical system 5 is made incident on the image pickup face 3 of the CCD 2. A pad 10 in such a ceramic substrate 1 is connected electrically to a pad 11 of the CCD 2 by mutual press-contacting fixation, and at the time of facing down the CCD 2 against the ceramic substrate 1, a bump is formed in advance on the pad 11 of the CCD 2, and the mutual press-contacting fixation between the pads 10, 11 can be attained by thermal press-contacting fixation. In such a way, since a module structure is obtained, in the case, the CCD 2 is fixed in parallel to a scope axis in the scope tip part of the electronic endoscope, it becomes convenient for thinning the diameter of its scope tip part.