Title:
冷却手段を備えた電子機器およびその冷却方法
Document Type and Number:
Japanese Patent JP7376117
Kind Code:
B2
Abstract:
To provide an electronic device having cooling means capable of preventing temperature rise on the surface of a housing with a simple configuration, and a cooling method therefor.SOLUTION: An electronic device includes a metal housing, a heat-generating component and cooling means disposed within the housing, and temperature measuring means that measures a temperature of the heat-generating component, and the cooling means cools the heat-generating component when the temperature of the heat-generating component is equal to or higher than a predetermined value, and cools an inner wall surface of the housing when the temperature of the heat-generating component is less than the predetermined value, and there is also provided a cooling method of the electronic device.SELECTED DRAWING: Figure 1
Inventors:
Tatsuo Akiba
Application Number:
JP2021016268A
Publication Date:
November 08, 2023
Filing Date:
February 04, 2021
Export Citation:
Assignee:
NEC Platforms, Ltd.
International Classes:
H05K7/20; G06F1/20; H01L23/34; H01L23/467; H05K7/18
Domestic Patent References:
| JP2002123336A | ||||
| JP2009027071A | ||||
| JP2007048917A | ||||
| JP2017199786A |
Foreign References:
| WO2018123119A1 |
Attorney, Agent or Firm:
Ken Ieiri