To provide techniques with which an electronic tag inlet with the desired characteristic property is easily and inexpensively manufactured.

A matching circuit pattern 3 to which high dimension precision is required, and antenna patterns 47A, 47B to which high dimension precision is not required, are formed from different materials through different processes, respectively. A body structure 48 comprised of the matching circuit pattern 3, a chip 5 and an insulating film 2 is bonded to the antenna patterns 47A, 47B using a resin adhesive material, for example, so that the insulating film 2 faces the antenna patterns 47A, 47B, and the body structure 48 and the antenna patterns 47A, 47B are proximately bonded to each other electrically via capacitors C1, C2, respectively.