Title:
ELECTRONIC EQUIPMENT SYSTEM AND VERTICAL RACK
Document Type and Number:
Japanese Patent JP2002366258
Kind Code:
A
Abstract:
To improve heat dissipation from servers when a plurality of thin servers are stacked in a rack.
In a structure in which the plurality of thin servers 101a, 101b, 101c and 101d are stacked in the rack, the individual servers are arranged while shifting each server by prescribed dimensions. An opening for heat radiation is formed at a part where each server is shifted. In such a configuration, heat radiation openings can be secured even though the thin servers are stacked in the rack, and heat dissipation from the inside of the servers can be improved.
Inventors:
MORI SHIGEKI
ANZAI SEITETSU
TAKEUCHI ATSUYA
ANZAI SEITETSU
TAKEUCHI ATSUYA
Application Number:
JP2001166376A
Publication Date:
December 20, 2002
Filing Date:
June 01, 2001
Export Citation:
Assignee:
IBM
International Classes:
G06F1/16; G06F1/20; H05K7/18; H05K7/20; (IPC1-7): G06F1/20; G06F1/16; H05K7/18; H05K7/20
Attorney, Agent or Firm:
Hiroshi Sakaguchi (2 outside)