To provide electronic equipment capable of normally operating an electronic component in a long term without generating peeling between the copper plated layer and solder of an external connection pad.

This electronic equipment is configured by mounting an electronic component 2 on an insulating substrate 1 whose upper face is formed with an electronic component connection pad 3, and whose lower face is formed with an external connection pad 43, and electrically connecting the electrode of the electronic component 2 to the electronic component connection pad 3. An external connection pad 4 is configured by coating a copper plated layer 5 with a solder layer 6 containing tin, and an inclined alloy layer 15 containing copper and tin is formed between the copper plated layer 5 and the solder layer 6.