ELECTRONIC MODULE ASSEMBLY - FORD GLOBAL TECH LLC

Title:

ELECTRONIC MODULE ASSEMBLY

Document Type and Number:

Japanese Patent JP2005354693

Kind Code:

A

Abstract:

To improve a method for reducing effect of electromagnetic interference in electronic components of a hybrid electric automobile.

An electronic module assembly 10 includes an electronic module constituent part 12 which discharges EMI noise. The electronic module assembly has a first electric reference area 16 and a second electric reference area 20 communicating to the electric module constituent part 12. An impedance constituent part 22 is disposed in series with the first electric reference area 16 and the second electric reference area 20 so as to attenuate a first electromagnetic noise signal. The electronic module assembly further includes a low-pass filter constituent part 24 electrically communicating with the electronic module constituent part 12. Moreover, the present invention provide a method for reducing EMI noise discharge.

Inventors:

CHEN CHINGCHI

Application Number:

JP2005166710A

Publication Date:

December 22, 2005

Filing Date:

June 07, 2005

Export Citation:

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Assignee:

FORD GLOBAL TECH LLC

International Classes:

H03H7/01; B60R16/02; H03H1/00; H03H7/00; H03H7/06; H03H7/075; H03H7/09; H04B15/00; H04B15/02; H05K1/02; H05K1/14; H05K1/18; (IPC1-7): H03H7/01; H03H7/06; H03H7/075; H03H7/09

Domestic Patent References:

JP2002113236A

2002-04-16

Attorney, Agent or Firm:

Hiroshi Maeda
Hiroshi Koyama
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori

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