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Patent Searching and Data


Title:
電子モジュール
Document Type and Number:
Japanese Patent JP2014518003
Kind Code:
A
Abstract:
The invention relates to an electronic module comprising at least one electronic or electric component (3), a base plate (4), and a support plate (2), in particular a printed circuit board or a substrate. Said support plate (2) is arranged on the base plate (4) and comprises conductor paths. Said base plate (4) comprises a blind hole-type recess (5) on a side oriented towards the support plate (2). The component (3) is in contact on the support plate (2) and is arranged in the recess (5) of the base plate (4).

Inventors:
Helmut Boubeck
Thomas Muller
Ralph Sinzel
Matias roussman
Holger Brown
Klaus Voigtlender
Benjamin Birch
Application Number:
JP2014501506A
Publication Date:
July 24, 2014
Filing Date:
February 29, 2012
Export Citation:
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Assignee:
ROBERT BOSCH GMBH
International Classes:
F16H61/00; H05K1/18; H01L25/00; H05K1/02
Domestic Patent References:
JPH04251969A1992-09-08
JPH08148646A1996-06-07
JP2001257306A2001-09-21
JP2002026481A2002-01-25
Foreign References:
US20090244874A12009-10-01
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Takuya Kuno