Title:
可変厚さのモールドキャップを有する電子パッケージング
Document Type and Number:
Japanese Patent JP2013537372
Kind Code:
A
Abstract:
An electronic package with improved warpage compensation. The electronic package includes a mold cap having a variable thickness. The variable thickness can have a mound or dimple design. In another embodiment, a method is provided for reducing unit warpage of an electronic package by designing the topography of a mold cap to compensate for warpage.
Inventors:
Vivek Ramados
Gopal Sea Jar
Christopher Jay Healy
Gopal Sea Jar
Christopher Jay Healy
Application Number:
JP2013529300A
Publication Date:
September 30, 2013
Filing Date:
September 14, 2011
Export Citation:
Assignee:
Qualcomm, Inc.
International Classes:
H01L25/04; H01L21/56; H01L23/28; H01L25/18
Domestic Patent References:
| JPS5879739A | 1983-05-13 | |||
| JP2010141261A | 2010-06-24 | |||
| JP2002261200A | 2002-09-13 | |||
| JP2008133630A | 2008-06-12 | |||
| JP2008166816A | 2008-07-17 | |||
| JP2000323623A | 2000-11-24 | |||
| JP2006344898A | 2006-12-21 | |||
| JP2003218290A | 2003-07-31 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Kuroda Shinpei
Kuroda Shinpei