Title:
ELECTRONIC PART AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2005223036
Kind Code:
A
Abstract:
To provide an electronic part promoting its own thinning and miniaturization, and also to provide a manufacturing method for the electronic part.
The rear 11b of a substrate 11c for an electronic element 11 is positioned on the same virtual plane A as the top face 13b1 of the side wall 13b of a box body 13, and the upper section of the rear 11b is coated with a sealant 16. Accordingly, an opening is not formed between the sealant 16 and the rear 11b of the electronic element 11, and the thinning of the electronic part is promoted easily. Since the sealant 16 is formed of a resin, an error on an displacement is absorbed easily even when the places of the rear 11b of the substrate 11c and the top face 13b1 of the side wall 13b are displaced.
Inventors:
TAKEUCHI HIDEAKI
SASAKI HITOSHI
KONDO HIDEKI
WAGA SATOSHI
SASAKI HITOSHI
KONDO HIDEKI
WAGA SATOSHI
Application Number:
JP2004027588A
Publication Date:
August 18, 2005
Filing Date:
February 04, 2004
Export Citation:
Assignee:
ALPS ELECTRIC CO LTD
International Classes:
H01L23/10; H01L23/02; H01L23/08; H03H3/08; H03H9/02; (IPC1-7): H01L23/10; H01L23/02; H01L23/08
Attorney, Agent or Firm:
野▲崎▼ 照夫
Masayoshi Miwa
Masayoshi Miwa
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