PURPOSE: To provide a simply constituted electronic part mounting apparatus for effectively and reliably mounting electronic parts on both sides of a substrate.

CONSTITUTION: One or more semiconductor chips are mounted on the first surface of an insulating substrate 20. One or more semiconductor chips are mounted on the second surface of the substrate 20 such that they are not positioned below the semiconductor chips on the first surface. A protective body 40 is integrated into the insulating substrate 20. The protective body 40 has openings for exposing each area 30 for mounting a semiconductor chip and the proximity thereto; the height of the protective body 40 is larger than the maximum height of the electronic parts 50.