PURPOSE: To provide an electronic part mounting device in which a bonding agent does not flow into a bonding hole.

CONSTITUTION: This electronic part mounting device comprises a base material 1 for an IC card, a plurality of bonding holes 2 provided in the periphery of a predetermined mounting part 11 for an electronic part mounted on the base material 1 by using a bonding agent and provided in the base material 1, an inflow preventing frame 3 provided in the base material so as to surround the bonding holes 2 for preventing the bonding agent from flowing into the bonding holes 2, a sealing resin flow stopping frame disposed so as to surround the inflow preventing means and a terminal pad layer 4 formed on the rear side of the base material 1. The electronic part is bonded by a bonding agent 7 and sealed with a resin, thereby making an electronic part mounting device.