Title:
ELECTRONIC PART MOUNTING SYSTEM AND ELECTRONIC PART MOUNTING METHOD
Document Type and Number:
Japanese Patent JP3656542
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic part mounting system and electronic part mounting method in which an abnormal operation is sensed in advance to exclude waste due to failure.
SOLUTION: The electronic part mounting system is provided in which an electronic part is mounted by soldering on a board comprising a plurality of electronic part mounting machines M1-M7 which are connected together. Whether a printing device, a part mounting machine and a soldering means are correctly operated or not is judged based on a solder position data acquired by a print inspection device as well as a part position data acquired by a mounting state inspection device, at each process among a printing process, a solder position detecting process, a mounting process, a part position detecting process, and a solder/jointing process during mounting electronic parts. The result is reported so that the condition of each mounting machine constituting the mounting system is always grasped, allowing an abnormal operation to be sensed in advance for excluding waste due to failure.
Inventors:
Masafumi Inoue
Tsukamoto Manaya
Masato Fujioka
Tsukamoto Manaya
Masato Fujioka
Application Number:
JP2000325321A
Publication Date:
June 08, 2005
Filing Date:
October 25, 2000
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
G01R31/28; B23K1/00; G01N21/956; H05K3/34; H05K13/04; H05K13/08; B23K101/42; (IPC1-7): H05K13/08; H05K13/04
Domestic Patent References:
| JP7321492A | ||||
| JP8204399A | ||||
| JP8018286A |
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito
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