Title:
ELECTRONIC PART, SOLID ELECTROLYTIC CAPACITOR AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2006086349
Kind Code:
A
Abstract:
To avoid that the moisture resistance over the element falls by bending lead terminals 3 and 4 so that the part of the element 2, such as a semiconductor chip, etc. may move to the bottom of the package body in an electronic part which seals and changes so that the lead terminals 3 and 4 electrically connected with the element may project from the side face of the package body in the package body 5 made of a synthetic resin.
A synthetic resin 6 is applied so that both the front surfaces of the lead terminals 3 and 4 and the front surface of the package body 5 may be bridged over the part of the root part as opposed to the package body 5 among the lead terminals 3 and 4.
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Inventors:
NAKA KENTARO
Application Number:
JP2004269877A
Publication Date:
March 30, 2006
Filing Date:
September 16, 2004
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01G9/10; H01G4/224; H01G4/228; H01G9/00; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Akio Ishii
Tadashi Higashino
Hiroyuki Nishi
Tadashi Higashino
Hiroyuki Nishi
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