Title:
ELECTRONIC PART FOR SURFACE MOUNTING
Document Type and Number:
Japanese Patent JPH03273058
Kind Code:
A
Abstract:
PURPOSE:To avoid the melting and foaming during solder mounting and to improve dimensional stability by molding a compsn. contg. a semi-arom. polyamide, two specific polymers, and a glass fiber. CONSTITUTION:A polyamide resin compsn. is prepd. by compounding (a)wt.% arom. polyamide obtd. by reacting a semi-arom. dicarboxylic acid component contg. 45-70mol% adipic acid and 30mol% terephthalic acid with hexamethylenediamine, (b)wt.% polymer contg. 50-80wt.% bromine and obtd. by brominating a styrenic polymer contg. 0.01-20mol% acid anhydride group, (c)wt.% polymer contg. 50-80wt.% bromine and obtd. by brominating a polystyrene, and (d)wt.% glass fiber in such a wt. ratio that formulas I to V are satisfied. The compsn. is melt mixed and molded to give the title part.
Inventors:
EBARA KENJI
NAKABASHI JUNICHI
NAKABASHI JUNICHI
Application Number:
JP7203190A
Publication Date:
December 04, 1991
Filing Date:
March 23, 1990
Export Citation:
Assignee:
ASAHI CHEMICAL IND
International Classes:
C08K7/14; C08L25/04; C08L73/00; C08L77/00; C08L77/06; (IPC1-7): C08K7/14; C08L25/04; C08L77/06
Attorney, Agent or Firm:
Norio Kagami (2 others)
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