Title:
ELECTRONIC-PART-TAPING STRUCTURE
Document Type and Number:
Japanese Patent JP2740500
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent an electronic part from being dropped or displaced as by an external force and maintain initial dimensional accuracy, by applying an adhesive in advance to the entire periphery of a lead in an area where a taping paper-mount and adhesive tape are stuck together, and by bonding it thereto by the application of pressure.
SOLUTION: The entire periphery of a lead 2 in an area where a taping paper-mount 5 and adhesive tape 4 are stuck together is covered with adhesive tape 4 used for applying an adhesive 3 in advance by a method such as spraying or coating, and it is bonded thereto by exerting pressure by means of a roller or trowel. Thus, because the application of the adhesive 3 to the entire periphery of the lead 2 in the sticking area makes the area where the lead 2 is stuck to the taping paper-mount 5 and adhesive tape 4 larger than a vertical sticking area, an electronic part 1 is prevented from being dropped or displaced as by an external force, and initial dimensional accuracy can be maintained.
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Inventors:
Takahashi Takaki
Application Number:
JP10525396A
Publication Date:
April 15, 1998
Filing Date:
April 25, 1996
Export Citation:
Assignee:
Yamagata NEC Corporation
International Classes:
B65D73/02; B65B15/04; B65D85/86; H05K13/02; (IPC1-7): B65D85/86; B65B15/04; B65D73/02; H05K13/02
Domestic Patent References:
| JP60130899A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
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