Title:
ELECTRONIC COMPONENT ASSEMBLY
Document Type and Number:
Japanese Patent JP2019186249
Kind Code:
A
Abstract:
To provide an electronic component assembly in which the number of chip components connected to metal terminals can be freely adjusted.SOLUTION: An electronic component assembly 2 includes: an electronic component 10 having a metal terminal 30 coupled to a plurality of chip components 20; an electronic component 100 having a metal terminal 130 coupled to the plurality of chip components 20; and a connecting member 60 that connects these electronic components.SELECTED DRAWING: Figure 1A
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Inventors:
ANDO NORIHISA
MASUDA ATSUSHI
MORI MASAHIRO
MATSUNAGA KAYO
YAZAWA KOSUKE
MASUDA ATSUSHI
MORI MASAHIRO
MATSUNAGA KAYO
YAZAWA KOSUKE
Application Number:
JP2018070904A
Publication Date:
October 24, 2019
Filing Date:
April 02, 2018
Export Citation:
Assignee:
TDK CORP
International Classes:
H01G2/02; H01G2/06; H01G4/30
Domestic Patent References:
JPH09283702A | 1997-10-31 | |||
JP2002057063A | 2002-02-22 | |||
JPS4966362U | 1974-06-10 |
Foreign References:
WO2016134804A1 | 2016-09-01 |
Attorney, Agent or Firm:
Maeda/Suzuki International Patent Corporation