Title:
ELECTRONIC PARTS AND BONDING METHOD THEREOF
Document Type and Number:
Japanese Patent JP3109883
Kind Code:
B2
Abstract:
PURPOSE: To prevent the generation of defective parts and to enable crossover wiring in fine patterns by forming a wire for wiring to a state of supporting this wire with a prebonding part.
CONSTITUTION: The wire 2 for wiring is bonded like a ball to a conductor 1b before the wire is bonded to the conductor 1a, by which the prebonding part 6 is provided slightly nearer the conductor 1c than the 2nd bonding part 4. A capillary is then moved onto the conductor 1a and a spherical part is formed at the end of the wire 2 for wiring projecting from the capillary This spherical part is press welded and connected to the 1st bonding part 3 of the conductor 1a. The capillary is thereafter moved onto the conductor 1a in such a manner that the wire 2 for wiring passes right above the prebonding part 6 and the wire 2 for wiring is press welded and connected to the 2nd bonding part 4. The wire 2 for wiring is, therefore, pressed and supported to the prebonding part 6 in the 2nd bonding part 4 and is lifted in the direction parting from the conductor 1a. A sufficient spacing is obtd. therebetween.
Inventors:
Masato Aritome
Application Number:
JP34249491A
Publication Date:
November 20, 2000
Filing Date:
November 29, 1991
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
G02F1/1345; H01L21/60; (IPC1-7): G02F1/1345
Domestic Patent References:
| JP6173344A | ||||
| JP210328A | ||||
| JP357938U | ||||
| JP499832U |
Attorney, Agent or Firm:
Minoru Shinoda