ELECTRONIC COMPONENT, CIRCUIT MODULE AND ELECTRONIC APPARATUS

Japanese Patent JP2016058618

A

PROBLEM TO BE SOLVED: To provide an electronic component suitable for compaction, and excellent in mountability, and to provide a circuit module and an electronic apparatus.SOLUTION: An electronic component includes a dielectric layer, a first through hole, a second through hole, a first external conductor layer, a second external conductor layer, a third external conductor layer, a fourth external conductor layer, a first internal conductor, a second internal conductor, and a third internal conductor. The dielectric layer is formed by anodic oxidation of a metal. Cross sectional area of the second through hole is two times or more that of the first through hole. The first internal conductor is housed in a part of the first through hole, connected with the first external conductor layer, and separated from the second external conductor layer. The second internal conductor is housed in another part of the first through hole, connected with the second external conductor layer, and separated from the first external conductor layer. The third internal conductor is housed in the second through hole, and connected with the third external conductor layer and fourth external conductor layer.SELECTED DRAWING: Figure 1

MASUDA HIDETOSHI

JP2014185259A

April 21, 2016

September 11, 2014

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TAIYO YUDEN KK

H01G4/33

JP2009054980A	2009-03-12
JP2009088034A	2009-04-23
JP2014011419A	2014-01-20
JP2008078301A	2008-04-03
JP2011176245A	2011-09-08
JP2001320171A	2001-11-16

WO2012002083A1

2012-01-05

Junichi Omori
Ori Akira
Masayoshi Sekine
Teppei Nakamura
Ayako Kaneko
Nozomi Yoshida
Shintaro Kanayama

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