Title:
ELECTRONIC PARTS HOUSING CASE FOR MOUNTING
Document Type and Number:
Japanese Patent JP3648818
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To mount electronic parts on an external circuit board simultaneously with other electronic parts by a solder reflow method or a flow solder dipping method even when the electronic parts are composed a multilayered circuit board, IC package, etc., having a weak heat resistance.
SOLUTION: In order to prevent the transmission of external heat to electronic parts 4, an electronic parts housing case 1 for mounting is provided. The case 1 is provided with a resin case main body section 3 for housing the parts 4 and a plurality of terminal blocks 6 which are partially buried in the main body section 3 so that the blocks 6 can be positioned along the edge section 5 of the section 3 which controls the opening 2 of the section 3. Each terminal block 6 is connected to the terminals of the parts 4 and, at the same time, soldered to an external circuit board 21. Each terminal block 6 has exposed parts on both surfaces so that heat can be radiated efficiently from the block 6.
Inventors:
Shigeyuki Takeuchi
Application Number:
JP33458495A
Publication Date:
May 18, 2005
Filing Date:
December 22, 1995
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01L25/18; H01L23/02; H01L23/12; H01L25/04; H05K1/14; H05K3/34; H05K3/36; (IPC1-7): H01L23/02; H01L23/12
Domestic Patent References:
| JP5090440A | ||||
| JP6045391U | ||||
| JP54104965U |
Attorney, Agent or Firm:
Masaaki Koshiba
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