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Title:
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2016081854
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component having a stable value of resistance, and a wiring pattern of three-dimensional shape, and to provide a method of manufacturing the same.SOLUTION: An electronic component has a film base material 11 having a three-dimensional shape, a wiring pattern 12 composed of conductive polymer 20 formed on the film base material 11, and a vinyl chloride-based moistureproof film 14 formed on the wiring pattern 12. Since a vinyl chloride-based moistureproof film 14 is used, moisture proofness can be maintained even if deformed after formation of the wiring pattern. Since the moistureproof effect for the conductive polymer 20 does not deteriorate even in the wiring pattern 12 of three-dimensional shape deformed by three-dimensional molding, the value of resistance of the wiring pattern 12 can be maintained stably.SELECTED DRAWING: Figure 2

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Inventors:
TAKAHASHI HIDEKAZU
CHIBA SHUSUKE
SASAKI NOBUHIKO
Application Number:
JP2014214957A
Publication Date:
May 16, 2016
Filing Date:
October 22, 2014
Export Citation:
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Assignee:
ALPS ELECTRIC CO LTD
International Classes:
H01H36/00; B29C45/14; B32B27/30; H01B5/14; H01B13/00; H03K17/96
Domestic Patent References:
JP2010267607A2010-11-25
JPS632217A1988-01-07
JP2007052975A2007-03-01