Title:
ELECTRONIC PARTS MOUNTER AND MOUNTING METHOD
Document Type and Number:
Japanese Patent JP3656533
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic parts mounter and a mounting method in which incomplete mounting due to positional shift of the solder printed pattern can be prevented at the time of mounting an electronic part.
SOLUTION: When an electronic part is picked up by means of a mounting head and mounted on a substrate, position of a cream solder S printed on an electrode 1a is measured previously and the measurements are stored. At the time of mounting operation of an electronic part by means of the mounting head, a mounting coordinate is operated based on the measurement of the printed solder pattern position. The mounting head is controlled using a mounting coordinate based on the solder position and an electronic part is mounted on each electrode 1a of the substrate 1. Since positional shift of the electronic part 2 and the printed cream solder S is eliminated under mounted state, incomplete mounting due to that positional shift can be prevented at the time of reflow.
Inventors:
Masafumi Inoue
Yusuke Yamamoto
Onizaki Hikaru
Yoichi Yang
Yasuhiro Morimitsu
Yusuke Yamamoto
Onizaki Hikaru
Yoichi Yang
Yasuhiro Morimitsu
Application Number:
JP2000272823A
Publication Date:
June 08, 2005
Filing Date:
September 08, 2000
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K13/04; H05K13/08; (IPC1-7): H05K13/04
Domestic Patent References:
| JP5251897A | ||||
| JP4002200A | ||||
| JP4034990A | ||||
| JP7022791A | ||||
| JP4048248A |
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito
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