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Patent Searching and Data


Title:
ELECTRONIC PARTS MOUNTING DEVICE
Document Type and Number:
Japanese Patent JP2002043797
Kind Code:
A
Abstract:

To provide an electronic parts mounting device which surely prevent large impact to an electronic parts to be mounted on a circuit board and apply precisely controlled pressure in a very low pressure range without dispersion and with good reproducibility.

Each circumference edge of plural pieces of discoid elastic supporting parts 34, 37 is fixed to several positions of a vertically moving casing 31 in the vertical direction and the elastic supporting parts 34, 37 are installed horizontally. A bonding shaft 39 is adhered to each center of the elastic supporting parts 34, 37 and is supported in the condition of which a vertical motion is possible in the range that each elastic supporting parts 34, 37 is elastically deformed. An actuator 20 is installed to apply downward pressure to the bonding shaft 39.


Inventors:
KIYOMURA HIROYUKI
YONEZAWA TAKAHIRO
SASAOKA TATSUO
TOKUNAGA TETSUYA
Application Number:
JP2000229540A
Publication Date:
February 08, 2002
Filing Date:
July 28, 2000
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B25J15/06; H05K13/04; (IPC1-7): H05K13/04; B25J15/06
Attorney, Agent or Firm:
Ishihara Masaru