Title:
ELECTRONIC PARTS MOUNTING DEVICE
Document Type and Number:
Japanese Patent JP3128354
Kind Code:
B2
Abstract:
PURPOSE: To provide an electronic parts mounting device of simple construction which can accurately control a pressing force acting on an electronic part at the time of mounting it to a printed board.
CONSTITUTION: An automatic electronic parts mounting device comprises a suction head mechanism 4 to suck and hold an electronic part 3, a head lifting mechanism which lifts the suction mechanism up and down to a printed board 31 at an electronic part mounting position, substrate carrier mechanism 7 which carries the printed board to a standby position below the suction head mechanism 4, and a substrate lift mechanism 8 which lifts and moves the printed board at the standby position to the electronic part mounting position. A force sensor 6 to measure a pressing force to which the printed board is subjected at the time of mounting an electronic part is arranged at the substrate lift mechanism 8. Operation of the head lift mechanism is controlled according to a detection signal of the force sensor 6 and the electronic part 3 is pressed and adhered by a preset pressing force onto the printed board 31.
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Inventors:
Yoshitoshi Morita
Akira Sakaguchi
Michio Kunimitsu
Akira Sakaguchi
Michio Kunimitsu
Application Number:
JP28412892A
Publication Date:
January 29, 2001
Filing Date:
October 22, 1992
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
B23P21/00; H05K13/04; H05K13/08; (IPC1-7): H05K13/04; H05K13/08
Domestic Patent References:
| JP63150186A | ||||
| JP63174780A | ||||
| JP410399U |
Attorney, Agent or Firm:
Toshiyuki Maruyama (3 others)