Title:
Electronic parts mounting device
Document Type and Number:
Japanese Patent JP6108380
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus which can realize different vertical movement speeds and vertical movement strokes depending on components.SOLUTION: The electronic component mounting apparatus comprises a mounting head 10 incorporating a plurality of nozzles 12, 13 vertically movable to attach to an electronic component and to mount it on a printed board. The nozzle 12 and the nozzle 13 vertically move by vertical movement mechanisms different from each other. That is, the nozzle 12 vertically moves by a linear motor 12a, and the nozzle 13 vertically moves by a ball screw mechanism using a servo motor 13a.
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Inventors:
Park Holy Holy
Application Number:
JP2012128205A
Publication Date:
April 05, 2017
Filing Date:
June 05, 2012
Export Citation:
Assignee:
HANWHA TECHWIN CO.,LTD.
International Classes:
H05K13/04
Domestic Patent References:
| JP2003174044A | ||||
| JP2011018816A | ||||
| JP2008227400A | ||||
| JP2011129599A | ||||
| JP2010283298A | ||||
| JP2010165929A | ||||
| JP2001203497A | ||||
| JP8330790A |
Foreign References:
| WO2007111296A1 |
Attorney, Agent or Firm:
Masu Kobori
Takato Tsutsumi
Hiroo Ohara
Takato Tsutsumi
Hiroo Ohara