BALL-SHAPED Au-Ge-Sn-BASED SOLDER ALLOY AND ELECTRONIC COMPONENT USING THE SOLDER ALLOY

Title:

BALL-SHAPED Au-Ge-Sn-BASED SOLDER ALLOY AND ELECTRONIC COMPONENT USING THE SOLDER ALLOY

Document Type and Number:

Japanese Patent JP2016059943

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide at low cost, a Pb-free Au-Ge-Sn-based solder alloy for high temperature use excellent in wet spreadability and bondability, having high bond reliability and adequately usable for bonding and sealing electronic components such as a quartz crystal device or SAW filter for which extremely high reliability is required.SOLUTION: There is provided a ball-shaped Au-Ge-Sn-based solder alloy comprising 0.01-10.0 mass% Ge, 32.0-40.0 mass% Sn and the balance Au with inevitable impurities and having a ratio of major axis/minor axis of 1.00 to 1.20 or less. The major axis/minor axis ratio (X1/Z1), when mashing up the ball-shaped Au-Ge-Sn-based solder alloy from one direction, may be 1.00 to 1.50.SELECTED DRAWING: Figure 2

Inventors:

IZEKI TAKASHI

Application Number:

JP2014189847A

Publication Date:

April 25, 2016

Filing Date:

September 18, 2014

Export Citation:

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Assignee:

SUMITOMO METAL MINING CO

International Classes:

B23K35/30; C22C5/02; H05K3/34

Attorney, Agent or Firm:

Noriyuki Tsujikawa
Masao Yamamoto

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