Title:
ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2017208468
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To solve a problem in that, in an electronic component, an optical member and an electronic device or a mounting member on which the electronic device is disposed are fixed together with an adhesive member; but if a temperature change occurs during an electronic component manufacturing process and in an electronic component, the optical member composing the electronic component may expand or contract, leading to stress in the interface between the optical member and the adhesive member; the stress increases towards the outside (the outer edges) of the electronic component, so that resistance due to adhesive force caused in the interface between the optical member and the adhesive member is produced against this stress, which may result in damage to the optical member.SOLUTION: An optical member has a first area and a second area composing an interface with an adhesive member. In a second direction intersecting a first direction, the first area is provided further outside than the second area. Adhesive force in the interface between the first area and the adhesive member is weaker than adhesive force in the interface between the second area and the adhesive member.SELECTED DRAWING: Figure 2
Inventors:
NOZU KAZUYA
TSUZUKI KOJI
ABE MASAHIRO
TSUZUKI KOJI
ABE MASAHIRO
Application Number:
JP2016100329A
Publication Date:
November 24, 2017
Filing Date:
May 19, 2016
Export Citation:
Assignee:
CANON KK
International Classes:
H01L27/14; H01L23/02; H01L23/10; H04N5/335
Attorney, Agent or Firm:
Takuma Abe
Sogo Kuroiwa
Sogo Kuroiwa
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