Title:
ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JPS5448166
Kind Code:
A
Abstract:
PURPOSE: To obtain the electronic parts of the tape carrier system, which excels in the heat-resistance and ohmic contact performance.
CONSTITUTION: Copper foil 2 which is the lead of the tape carrier is used as the master material, and tin thin film 3 is provided on the surface of foil 2 with pad electrode 5 of IC chip 4 bonded on to be then resin-sealed (6). The solder resist or wiring protecting overlay film 7 are used to keep the bending intensity for polyimide film 1 and finger leads 2W3. Furthermore, tin-plated film 3 is removed at the areas of the finger leads to be connected with the electronic component parts. Then nickel plating film 9 is provided on the surface of foil 2 and then gold plating layer 10 is provided on the surface
Inventors:
ADACHI YOSHIO
NAKAMURA KENJI
OKA HITOSHI
OKUDAIRA HIROAKI
KAWANOBE TOORU
NAKAMURA KENJI
OKA HITOSHI
OKUDAIRA HIROAKI
KAWANOBE TOORU
Application Number:
JP11458177A
Publication Date:
April 16, 1979
Filing Date:
September 26, 1977
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H05K5/00; H01L21/60; H01L23/12; H05K5/06; (IPC1-7): H01L23/12; H01L23/30; H05K5/06