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Patent Searching and Data


Title:
ELECTRONIC STAMP
Document Type and Number:
Japanese Patent JPH05177916
Kind Code:
A
Abstract:

PURPOSE: To effectively use stencil paper by changing the stamping range in response to the size of type area by a method wherein a punched data inputting means, a punching means and a means, with which the stencil paper is partially masked to the stencil type area, are provided

CONSTITUTION: In order to produce newly formatted type area, heat-sensitive stencil paper 8 is delivered by rotating a platen 13 under the condition being pushed between the platen 13 and the heat generating bodies of a thermal head 12. At this time, the heat generating bodies of the thermal head 12 selectively generate heat in conforming to the characters and layout inputted at an inputting section 2 in order to thermally perforate the heat-sensitive stencil paper 8. The delivered heat-sensitive stencil paper 8 is taken up with a base paper take-up spool 9 so as to be stopped, at the position just below an ink pad 7. Next, printing is completed by pushing a housing 4, which moves integral with the ink pad 7, against the stencil paper 8 so as to apply ink infiltrated in the ink pad 7 through the holes made on the heat-sensitive stencil paper 8 onto the surface to be printed.


Inventors:
FUWA TETSUJI
Application Number:
JP34672991A
Publication Date:
July 20, 1993
Filing Date:
December 27, 1991
Export Citation:
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Assignee:
BROTHER IND LTD
International Classes:
B41L13/02; B41K1/32; B41L13/18; B41M1/12; (IPC1-7): B41L13/02; B41L13/18; B41M1/12