Title:
METAL-BASE MULTILAYERED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3199599
Kind Code:
B2
Abstract:
PURPOSE: To sufficiently radiate heat generated from high heat generating electric parts by mounting a circuit board on an insulating adhesive layer formed on a metallic plate and the electronic parts on the adhesive layer with a highly heat conductive agent.
CONSTITUTION: A circuit board provided with metallic layers 5A and 5B and an opening at part is laminated on a metallic plate 1 with an insulating adhesive layer 2 in between. Then high heat generating electronic parts 4 are mounted on the adhesive layer 2 with a highly heat conductive adhesive 3. The layer 2 is composed of an epoxy resin containing aluminum oxide, silicon oxide, or boron nitride and stuck to the metallic layers by using a press method or laminator method after a resin containing an inorganic filler is applied to the metallic plate 1. Such inorganic powder that has a high electricity insulating property, heat conductivity, and resin filling property is composed of round particles having diameters of ≤150μm and suitable particle distribution and used as the inorganic filler so that the heat radiating property of the mounted electronic parts can be improved.
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Inventors:
Naomi Yonemura
Toshiki Saitoh
Makoto Fukuda
Toshiki Saitoh
Makoto Fukuda
Application Number:
JP8700295A
Publication Date:
August 20, 2001
Filing Date:
April 12, 1995
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
International Classes:
C09J9/00; C09J163/00; H05K1/05; H05K1/18; H05K1/02; H05K3/30; (IPC1-7): H05K1/05; C09J163/00; H05K1/18
Domestic Patent References:
| JP529371A | ||||
| JP6181370A |