Title:
電子織物及びその製造方法
Document Type and Number:
Japanese Patent JP5277249
Kind Code:
B2
Abstract:
Disclosed herein is an electronic fabric and preparing thereof. The electronic fabric comprises a backing layer configured to have a circuit electrically floated and a surface layer configured to electrically connect to the circuit of the backing layer. The backing layer or the surface layer comprises a) a base layer composed of a synthetic, regenerated or natural fiber and b) a conductive layer formed on the base layer to be capable of being freely formed by a pre-designed electric pattern. The base layer and the conductive layer are successively formed to be symmetrically to the backing layer and the surface layer to each other. An insulating layer is formed on the backing layer or the surface layer, or a partial upper portion of the conductive layer, or in a region where the conductive layer is not formed.
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Inventors:
Park Sun Mi
Chokance
Jeong Kyung Hee
Chokance
Jeong Kyung Hee
Application Number:
JP2010529864A
Publication Date:
August 28, 2013
Filing Date:
October 16, 2008
Export Citation:
Assignee:
Colon Grotech, Inc.
International Classes:
D03D1/00; D03D11/00; A41D31/00; A41D31/02
Domestic Patent References:
| JP2005146499A | ||||
| JP2005525477A | ||||
| JP2005525481A | ||||
| JP2004526068A | ||||
| JP2008542565A | ||||
| JP2005524783A |
Foreign References:
| WO2005083164A2 |
Attorney, Agent or Firm:
Hidekazu Tanikawa
Morimoto Sudo
Morimoto Sudo