Title:
電子機器
Document Type and Number:
Japanese Patent JP4676012
Kind Code:
B2
Abstract:
According to one embodiment, an electronic device includes a printed circuit board housed in a housing, a surface mount part soldered to the printed circuit board, a cooling mechanism which covers the surface mount part from an opposite side to the printed circuit board, a reinforcing portion formed by supplying an adhesive to an outer peripheral edge of the surface mount part and the printed circuit board such as to be across each other, which reinforces a solder joint portion provided between the surface mount part and the printed circuit board and a spacer formed of the adhesive, which is set between the surface mount part and the cooling mechanism and supports the cooling mechanism.
Inventors:
Minoru Takizawa
Takahisa Funayama
Takahisa Funayama
Application Number:
JP2009134350A
Publication Date:
April 27, 2011
Filing Date:
June 03, 2009
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L23/40; H05K1/18; H05K3/28; H05K7/20
Domestic Patent References:
| JP6302727A | ||||
| JP2005032796A | ||||
| JP9017827A | ||||
| JP9306954A | ||||
| JP63181396A | ||||
| JP2008311458A |
Attorney, Agent or Firm:
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Tetsuya Kazama
Katsumura Hiro
Shoji Kawai
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Tetsuya Kazama
Katsumura Hiro
Shoji Kawai
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen