Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
電子機器
Document Type and Number:
Japanese Patent JP4745439
Kind Code:
B2
Abstract:
According to one embodiment, an electronic apparatus includes a housing, a first heating element in the housing, a heat sink in the housing, a first pressing member, a first heat pipe, and a second heat pipe. The first heat pipe has a plate shape, includes a first portion facing the first heating element and a second portion being outside the first heating element. The first heat pipe is configured to be bent by the first pressing member. The second heat pipe is connected to the second portion of the first heat pipe and the heat sink.

More Like This:
Inventors:
Yukihiko Hata
Application Number:
JP2009265354A
Publication Date:
August 10, 2011
Filing Date:
November 20, 2009
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Toshiba Corporation
International Classes:
F28D15/02
Domestic Patent References:
JP2009181215A
JP2003336976A
JP53096559A
Attorney, Agent or Firm:
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Katsumura Hiro
Shoji Kawai
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen