PURPOSE: To enable bubbles attached to the plating region of a printed wiring board to be removed by a method wherein a bubble control plate which controls the jetted gas bubbles in size is provided almost horizontally between a bubble generator and the lower end of the printed wiring board.

CONSTITUTION: An electroplating device 1 is provided with a plating tank 4 which is filled with plating solution 3 and houses a printed wiring plate 8 and an electrode 2, a bubble generator 5 is provided to the base of the plating tank 4, and a bubble control plate 9 provided with holes which control the jetted gas bubbles in size is provided almost horizontally between the bubble generator 5 and the end of the printed wiring board 8 apart from the generator 5 at a prescribed distance. For instance, if the bubble control plate 9 provided with holes 8mm in diameter and arranged in matrix is provided almost horizontally above the bubble jetting holes (diameter 3mm) of the bubble generator 5 10-15cm apart from them, the bubbles generating through the holes of the control plate 9 are made uniform in size and controlled to range from 8 to 20mm in diameter.