Title:
ELECTROPLATING DEVICE AND METHOD FOR MANUFACTURING CONDUCTIVE FILM USING THE SAME
Document Type and Number:
Japanese Patent JP2018178213
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electroplating device capable of suppressing generation of appearance unevenness when depositing a blackened layer, and a method for manufacturing a conductive film using the same.SOLUTION: An electroplating device 10 for continuously applying electroplating while transferring a long film F1 including a conductive layer on at least one side by a roll-to-roll method comprises feeding rolls 15c and 15f for winding and feeding the unwashed long film F1 immediately after being pulled up on a plating liquid surface in a plating tank 12, and nip rolls 16c and 16f for nipping the wound long belt between them and the feeding rolls 15c and 15f.SELECTED DRAWING: Figure 2
Inventors:
SHIMAMURA TOMIO
Application Number:
JP2017081786A
Publication Date:
November 15, 2018
Filing Date:
April 18, 2017
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
C25D7/06; H01B13/00
Attorney, Agent or Firm:
Noriyuki Tsujikawa