To provide an electroplating device capable of making a plating thickness distribution uniform even with a metallic bar of a deformed shape having ruggedness in its section or a broad metallic bar.
This electroplating device longitudinally transports the metallic bar 3 which is an object to be plated as a cathode electrode between a pair of anode electrodes 2 within a plating bath tank 1, is provided with a pair of current shielding plates 4 to cover the transverse ends of the metallic bar 3 from both surface sides of the metallic bar 3 at each of the transverse ends 3a, 3b of the metallic bar 3 and is provided with fluid nozzles 7 for fluidizing the plating liquid 6 in the lower part within the plating bath tank. Bipolar conductors 8, 9 are constituted by providing the front ends of a pair of the current shielding plates 4 and 5, 5 with metallic conductors so as to partly cover the transverse ends 3a, 3b of the metallic bar.
CHINDA SATOSHI
TOMOBE MASAKATSU
ITO HIDEJI
