Title:
電解めっき装置
Document Type and Number:
Japanese Patent JP6749056
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electrolytic plating apparatus that can provide a plated high-quality object, wherein a current collector can steadily take out electric current necessary for electrolytic plating from a power supplying electrode.SOLUTION: Plating apparatus 10 comprises long-sized plating tank 11, belt-like power supplying electrode 12 installed along the longitudinal direction of the plating tank 11, a transfer carrier 13 for transporting an object to be plated from one end to the other end in the longitudinal direction of the plating tank 11, and a current collector 14 that has a sliding surface 14a at the bottom thereof and is attached to the transfer carrier 13 in the state of the sliding surface 14a suppressed on the power supplying electrode 12. The current collector 14 is pressed on the power supplying electrode 12 by a pressing mechanism 16 that has at least one spring 17 installed respectively at one end and the other end of the current collector 14, wherein the pressing force at the one end of the pressing mechanism 16 is greater than that at the other end of the pressing mechanism 16.SELECTED DRAWING: Figure 2
Inventors:
Daisuke Mashita
Application Number:
JP2016189292A
Publication Date:
September 02, 2020
Filing Date:
September 28, 2016
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
C25D17/08; C25D17/00; C25D17/06; C25D21/00
Domestic Patent References:
| JP2013091817A | ||||
| JP51034532U | ||||
| JP2016029219A |